Proper Reflow Soldering Conveyor Speed Settings

Conveyor speed is one of the most critical parameters in reflow soldering. It directly affects the time the PCB spends in each zone, which determines how well the solder paste reaches peak temperature and how long it stays there.

A typical reflow profile includes four phases: preheat, soak, reflow, and cooling. The conveyor speed must be set so that each phase duration matches the solder paste manufacturer's recommendation.

General guidelines:

• Standard lead-free profile: conveyor speed 60-100 cm/min
• Preheat ramp rate: 1-3°C/s
• Soak time: 60-120s at 150-200°C
• Time above liquidus (TAL): 45-90s
• Peak temperature: 235-250°C for lead-free

Always verify your profile with a thermocouple attached to the PCB before production runs.