About High-Speed Dispensing Line
Our high-speed dispensing machines feature CCD vision positioning systems for precise automatic dispensing of glue, epoxy, silicone, and other fluids. Suitable for underfill, encapsulation, bonding, and conformal coating applications in semiconductor packaging, PCB assembly, and electronics manufacturing.
Available in inline and offline configurations, with multi-nozzle options for increased throughput and non-contact jetting valves for high-speed precision.
